| 1 |
Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process
Cho BJ, Shima S, Hamada S, Park JG
Applied Surface Science, 384, 505, 2016 |
| 2 |
Effect of slurry aging on stability and performance of chemical mechanical planarization process
Basim GB
Advanced Powder Technology, 22(2), 257, 2011 |
| 3 |
Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical-Mechanical Planarization of silica surfaces
Volkov DO, Dandu PRV, Goodman H, Santora B, Sokolov I
Applied Surface Science, 257(20), 8518, 2011 |
| 4 |
Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
Jeong S, Lee H, Cho H, Lee S, Kim H, Kim S, Park J, Jeong H
Applied Surface Science, 256(6), 1683, 2010 |
| 5 |
연마제 특성에 따른 차세대 금속배선용 Al CMP (chemical mechanical planarization) 슬러리 평가
차남구, 강영재, 김인권, 김규채, 박진구
Korean Journal of Materials Research, 16(12), 731, 2006 |
| 6 |
Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect
Chen KW, Wang YL, Liu CP, Yang K, Chang L, Lo KY, Liu CW
Thin Solid Films, 447, 531, 2004 |
