검색결과 : 20건
| No. | Article |
|---|---|
| 1 |
H2O Diffusion Barriers at Si-Si Direct Bonding Interfaces for Low Temperature Anneals Moriceau H, Rieutord F, Libralesso L, Ventosa C, Fournel F, Morales C, Mc Cormick T, Chevolleau T, Radu I Journal of the Electrochemical Society, 158(9), H919, 2011 |
| 2 |
Application of scatterometric porosimetry to characterize porous ultra low-k patterned layers Licitra C, Bouyssou R, El Kodadi M, Haberfehlner G, Chevolleau T, Hazart J, Virot L, Besacier M, Schiavone P, Bertin F Thin Solid Films, 519(9), 2825, 2011 |
| 3 |
Patterning of porous SiOCH using an organic mask: Comparison with a metallic masking strategy Darnon M, Chevolleau T, David T, Ducote J, Posseme N, Bouyssou R, Bailly F, Perret D, Joubert O Journal of Vacuum Science & Technology B, 28(1), 149, 2010 |
| 4 |
Scatterometric porosimetry: A new characterization technique for porous material patterned structures Bouyssou R, El Kodadi M, Licitra C, Chevolleau T, Besacier M, Posseme N, Joubert O, Schiavone P Journal of Vacuum Science & Technology B, 28(4), L31, 2010 |
| 5 |
Residue growth on metallic-hard mask after dielectric etching in fluorocarbon-based plasmas. I. Mechanisms Posseme N, Chevolleau T, Bouyssou R, David T, Arnal V, Barnes JP, Verove C, Joubert O Journal of Vacuum Science & Technology B, 28(4), 809, 2010 |
| 6 |
Multi-solvent ellipsometric porosimetry analysis of plasma-treated porous SiOCH films Licitra C, Bouyssou R, Chevolleau T, Bertin F Thin Solid Films, 518(18), 5140, 2010 |
| 7 |
Modifications of dielectric films induced by plasma ashing processes: Hybrid versus porous SiOCH materials Darnon M, Chevolleau T, David T, Posseme N, Ducote J, Licitra C, Vallier L, Joubert O, Torres J Journal of Vacuum Science & Technology B, 26(6), 1964, 2008 |
| 8 |
Poly-Si/TiN/HfO2 gate stack etching in high-density plasmas Le Gouil A, Joubert O, Cunge G, Chevolleau T, Vallier L, Chenevier B, Matko I Journal of Vacuum Science & Technology B, 25(3), 767, 2007 |
| 9 |
Analyses of chamber wall coatings during the patterning of ultralow-k materials with a metal hard mask: Consequences on cleaning strategies Chevolleau T, Darnon M, David T, Posseme N, Torres J, Joubert O Journal of Vacuum Science & Technology B, 25(3), 886, 2007 |
| 10 |
Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas Posseme N, Chevolleau T, David T, Darnon M, Louveau O, Joubert O Journal of Vacuum Science & Technology B, 25(6), 1928, 2007 |