| 1 |
Experimental study on thermosyphon boiling in 3-D micro-channels
Huang JH, Li SF, Liu ZH
International Journal of Heat and Mass Transfer, 131, 1260, 2019 |
| 2 |
Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling
Tan H, Wu LW, Wang MY, Yang ZH, Du PG
International Journal of Heat and Mass Transfer, 129, 681, 2019 |
| 3 |
Effect of nano-structure coating on thermal performance of thermosyphon boiling in micro-channels
Li SF, Bao YY, Wang PY, Liu ZH
International Journal of Heat and Mass Transfer, 124, 463, 2018 |
| 4 |
A new 3D chip cooling technology using micro-channels thermosyphon with super-moist fluids and nanofluids
Zhang KL, Liu ZH, Zheng BC
Energy Conversion and Management, 128, 44, 2016 |
| 5 |
Experimental study on heat transfer performance of lotus-type porous copper heat sink
Zhang HW, Chen LT, Liu Y, Li YX
International Journal of Heat and Mass Transfer, 56(1-2), 172, 2013 |
| 6 |
Numerical study on laminar convective heat transfer enhancement of microencapsulated phase change material slurry using liquid metal with low melting point as carrying fluid
Song SH, Liao Q, Shen WD, Ruan Y, Xu JF
International Journal of Heat and Mass Transfer, 62, 286, 2013 |
| 7 |
Critical heat flux in multi-microchannel copper elements with low pressure refrigerants
Park JE, Thome JR
International Journal of Heat and Mass Transfer, 53(1-3), 110, 2010 |
| 8 |
An Experimental Investigation on Heat Transfer Characteristics for Micro-Capillary Evaporator
Diao YH, Liu JR, Wang Y, Zhao YH
Experimental Heat Transfer, 22(2), 87, 2009 |
| 9 |
High heat flux flow boiling in silicon multi-microchannels - Part I: Heat transfer characteristics of refrigerant R236fa
Agostini B, Thome JR, Fabbri M, Michel B, Calmi D, Kloter U
International Journal of Heat and Mass Transfer, 51(21-22), 5400, 2008 |
| 10 |
High heat flux flow boiling in silicon multi-microchannels - Part II: Heat transfer characteristics of refrigerant R245fa
Agostini B, Thome JR, Fabbri M, Michel B, Calmi D, Kloter U
International Journal of Heat and Mass Transfer, 51(21-22), 5415, 2008 |
