| 1 |
Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating
Chan PF, Chiu YD, Dow WP, Krug K, Lee YL, Yau SL
Journal of the Electrochemical Society, 160(12), D3271, 2013 |
| 2 |
Accelerator Screening by Cyclic Voltammetry for Microvia Filling by Copper Electroplating
Chiu YD, Dow WP
Journal of the Electrochemical Society, 160(12), D3021, 2013 |
| 3 |
In Situ STM Study of Cu Electrodeposition on TBPS-Modified Au(111) Electrodes
Liu YF, Krug K, Lin PC, Chiu YD, Dow WP, Yau SL, Lee YL
Journal of the Electrochemical Society, 159(2), D84, 2012 |
| 4 |
Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes
Chiu YD, Dow WP, Krug K, Liu YF, Lee YL, Yau SL
Langmuir, 28(40), 14476, 2012 |
| 5 |
Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions
Chiu YD, Dow WP, Huang SM, Yau SL, Lee YL
Journal of the Electrochemical Society, 158(5), D290, 2011 |
| 6 |
Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide
Dow WP, Chiu YD, Yen MY
Journal of the Electrochemical Society, 156(4), D155, 2009 |
| 7 |
Publisher's Note: Microvia Filling by Cu Electroplating over a Au Seed Layer Modified by a Disulfide [J. Electrochem. Soc., 156, D155 (2009)]
Dow WP, Chiu YD, Yen MY
Journal of the Electrochemical Society, 156(6), S7, 2009 |
| 8 |
Filling mechanism in microvia metallization by copper electroplating
Dow WP, Yen MY, Liao SZ, Chiu YD, Huang HC
Electrochimica Acta, 53(28), 8228, 2008 |
| 9 |
Effects of Sintering Temperature on the Superconducting and Microstructural Properties of Bi1.7Pb0.4Sr1.6Ca2.4Cu3.6Oy Ag2O Composites
Chiu YD, Lei TS, Kao CH
Journal of Materials Science, 29(10), 2678, 1994 |
