| 1 |
ITO regulated high-performance n-Si/ITO/alpha-(FeO3)-O-2 Z-scheme heterostructure towards photoelectrochemical water splitting
Feng DQ, Qu JT, Zhang R, Sun XJ, Zheng LC, Liu H, Zhang XH, Lu ZM, Lu F, Wang WH, Dong H, Cheng YH, Liu H, Zheng RK
Journal of Catalysis, 381, 501, 2020 |
| 2 |
Experimental scheme for a stable molybdenum bilayer back contacts for photovoltaic applications
Karthikeyan S, Zhang LY, Hwang S, Campbell SA
Applied Surface Science, 449, 647, 2018 |
| 3 |
Novel perovskite-spinel composite conductive ceramics for SOFC cathode contact layer
Xin XS, Liu LM, Liu Y, Zhu QS
International Journal of Hydrogen Energy, 43(51), 23036, 2018 |
| 4 |
Effect of precursor materials on the performance of the NiFe2O4-based spinel layer for SOFC cathode-side contact application
Yu YT, Zhu JH, Bates BL
Solid State Ionics, 324, 40, 2018 |
| 5 |
Cathode-side electrical contact and contact materials for solid oxide fuel cell stacking: A review
Zhu JH, Ghezel-Ayagh H
International Journal of Hydrogen Energy, 42(38), 24278, 2017 |
| 6 |
Development of the contact layer and its role in the phase change process
Weigand B, Lipnicki Z
International Journal of Heat and Mass Transfer, 93, 1082, 2016 |
| 7 |
Effect of Ce0.43Zr0.43Gd0.1Y0.04O2-delta contact layer on stability of interface between GDC interlayer and YSZ electrolyte in solid oxide electrolysis cell
Kim SJ, Kim KJ, Choi GM
Journal of Power Sources, 284, 617, 2015 |
| 8 |
Investigation on growth behavior of multiphase silicon carbon film for front contact layer in a Si thin film solar cell
Kim SH, You DJ, Hwang ST, Lee HS, Lee S, Lee HM, Kim D
Solar Energy Materials and Solar Cells, 127, 98, 2014 |
| 9 |
Nano-structured morphological features of pulsed direct current magnetron sputtered Mo films for photovoltaic applications
Karthikeyan S, Hill AE, Pilkington RD
Thin Solid Films, 520(1), 266, 2011 |
| 10 |
Low resistivity ohmic contact to n-type poly-GaN using a Ti/Au/Ni/Au multilayer metal system
Uen WY, Li ZY, Lan SM, Yang TN, Chen YW, Liao SM
Solid-State Electronics, 51(3), 460, 2007 |
