검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Fabrication and characterization of micro-sized copper bump of multi-layer PCB by pulse-reverse electroplating Hong HS, Seo MH, Lee S, Hong SJ, Suk HG, Ahn JH Current Applied Physics, 11(1), S289, 2011 |
| 2 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy Jo JL, Lee JB, Kim JM, Shin YE, Jung SB Journal of Adhesion, 86(5-6), 470, 2010 |
| 3 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies Farley D, Dasgupta A, Caers JFJ Journal of Adhesion Science and Technology, 22(14), 1757, 2008 |