화학공학소재연구정보센터
검색결과 : 9건
No. Article
1 Perpendicular magnetic anisotropy in Ta/CoFeB/MgO systems synthesized on treated SiN/SiO2 substrates for magnetic memories
Mantovan R, Lamperti A, Tallarida G, Baldi L, Mariani M, Ocker B, Ahn SM, Barisic I, Ravelosona D
Thin Solid Films, 533, 75, 2013
2 Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating
Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P
Electrochimica Acta, 70, 286, 2012
3 Classification of suppressor additives based on synergistic and antagonistic ensemble effects
Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D
Electrochimica Acta, 56(13), 4724, 2011
4 Correlation between Cu (I)-complexes and filling of via cross sections by copper electrodeposition
Kondo K, Nakamura T, Okamoto N
Journal of Applied Electrochemistry, 39(10), 1789, 2009
5 Self-annealing textures of copper damascene interconnects
Lee DN, Lee HJ
Materials Science Forum, 467-470, 1333, 2004
6 Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology
Li CY, Zhang DH, Su SS, Lu PW, He X, Jia GJ, Chen Z, Wu SY, Kumar R
Thin Solid Films, 462-63, 172, 2004
7 Processing technology for the investigation of sub-50 nm copper damascene interconnects
Steinlesberger G, Engelhardt M, Schindler G, Kretz J, Steinhogl W, Bertagnolli E
Solid-State Electronics, 47(7), 1237, 2003
8 Microtexture measurement of copper damascene line with EBSD
Kim DI, Paik JM, Joo YC, Oh KH, Lee HC, Dicks K
Materials Science Forum, 408-4, 529, 2002
9 Texture investigations in damascene copper interconnects
Mirpuri K, Szpunar JA, Kozaczek K
Materials Science Forum, 408-4, 1627, 2002