검색결과 : 9건
No. | Article |
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1 |
Perpendicular magnetic anisotropy in Ta/CoFeB/MgO systems synthesized on treated SiN/SiO2 substrates for magnetic memories Mantovan R, Lamperti A, Tallarida G, Baldi L, Mariani M, Ocker B, Ahn SM, Barisic I, Ravelosona D Thin Solid Films, 533, 75, 2013 |
2 |
Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P Electrochimica Acta, 70, 286, 2012 |
3 |
Classification of suppressor additives based on synergistic and antagonistic ensemble effects Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D Electrochimica Acta, 56(13), 4724, 2011 |
4 |
Correlation between Cu (I)-complexes and filling of via cross sections by copper electrodeposition Kondo K, Nakamura T, Okamoto N Journal of Applied Electrochemistry, 39(10), 1789, 2009 |
5 |
Self-annealing textures of copper damascene interconnects Lee DN, Lee HJ Materials Science Forum, 467-470, 1333, 2004 |
6 |
Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology Li CY, Zhang DH, Su SS, Lu PW, He X, Jia GJ, Chen Z, Wu SY, Kumar R Thin Solid Films, 462-63, 172, 2004 |
7 |
Processing technology for the investigation of sub-50 nm copper damascene interconnects Steinlesberger G, Engelhardt M, Schindler G, Kretz J, Steinhogl W, Bertagnolli E Solid-State Electronics, 47(7), 1237, 2003 |
8 |
Microtexture measurement of copper damascene line with EBSD Kim DI, Paik JM, Joo YC, Oh KH, Lee HC, Dicks K Materials Science Forum, 408-4, 529, 2002 |
9 |
Texture investigations in damascene copper interconnects Mirpuri K, Szpunar JA, Kozaczek K Materials Science Forum, 408-4, 1627, 2002 |