화학공학소재연구정보센터
검색결과 : 18건
No. Article
1 Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres
Wen CK, Xin YQ, Chen SC, Chuang TH, Chen PJ, Sun H
Thin Solid Films, 677, 103, 2019
2 Preparation and characterization of copper thin film obtained by metal plasma immersion ion implantation and deposition
dos Santos DJ, Ito NM, de Oliveira MCL, Tavares LB, Salvadori MC, Antunes RA
Thin Solid Films, 649, 136, 2018
3 Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition
Im B, Kim S, Kim SH
Thin Solid Films, 636, 251, 2017
4 A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques
Giroire B, Ahmad MA, Aubert G, Teule-Gay L, Michau D, Watkins JJ, Aymonier C, Poulon-Quintin A
Thin Solid Films, 643, 53, 2017
5 Investigation of inhibiting properties of self-assembled films of 4-aminothiophenol on copper in 3.5% NaCl
Rajkumar G, Sagunthala R, Sethuraman MG
Journal of Adhesion Science and Technology, 29(11), 1107, 2015
6 Ionized vapor deposition of antimicrobial Ti-Cu films with controlled copper release
Stranak V, Wulff H, Ksirova P, Zietz C, Drache S, Cada M, Hubicka Z, Bader R, Tichy M, Helm CA, Hippler R
Thin Solid Films, 550, 389, 2014
7 Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain
Glushko O, Marx VM, Kirchlechner C, Zizak I, Cordill MJ
Thin Solid Films, 552, 141, 2014
8 The diffusion doping of Cu crystals with 0.1 at.% In at high annealing temperatures for surface segregation measurements
Madito MJ, Swart HC, Terblans JJ
Thin Solid Films, 542, 186, 2013
9 Control of oxidation state of copper in flame deposited films
Hadzifejzovic E, Elahi A, Caruana DJ
Thin Solid Films, 520(16), 5254, 2012
10 Grain coarsening mechanism of Cu thin films by rapid annealing
Sasajima Y, Kageyama J, Khoo K, Onuki J
Thin Solid Films, 518(23), 6883, 2010