| 1 |
Classical Critical Behaviors and Ginzburg Criteria for Polymer Mixtures
Cho JH
Macromolecular Research, 29(10), 681, 2021 |
| 2 |
Three-dimensional atomic force microscopy for ultra-high-aspect-ratio imaging
Akhtar I, Rehman MA, Choi W, Kumar S, Lee N, Cho SJ, Park HH, Park KH, Seo Y
Applied Surface Science, 469, 582, 2019 |
| 3 |
The effects of the bottom anti-reflective coating with different baked temperatures and thicknesses on nanoscale patterns
Zheng J, Li L, Chen WD
Applied Surface Science, 357, 937, 2015 |
| 4 |
Spectroscopic ellipsometry - Past, present, and future
Aspnes DE
Thin Solid Films, 571, 334, 2014 |
| 5 |
On the development of Finite-Difference Time-Domain for modeling the spectroscopic ellipsometry response of 1D periodic structures
Foo YS, Cheung KT, To CH, Zapien JA
Thin Solid Films, 571, 356, 2014 |
| 6 |
On the modeling of ellipsometry data at large angles of incidence using finite-difference time-domain
Foo Y, Cheung KT, To CH, Zapien JA
Thin Solid Films, 571, 669, 2014 |
| 7 |
Dynamic switching characteristic dependence on sidewall angle for phase change memory
Long XM, Miao XS, Sun JJ, Cheng XM, Tong H, Li Y, Yang DH, Huang JD, Liu C
Solid-State Electronics, 67(1), 1, 2012 |
| 8 |
Critical dimension and real-time temperature control for warped wafers
Ho WK, Tay A, Fu J, Chen M, Feng Y
Journal of Process Control, 18(10), 916, 2008 |
| 9 |
One step forward from run-to-run critical dimension control: Across-wafer level critical dimension control through lithography and etch process
Zhang QL, Poolla K, Spanos CJ
Journal of Process Control, 18(10), 937, 2008 |
| 10 |
Spectroscopic ellipsometry and reflectometry from gratings (Scatterometry) for critical dimension measurement and in situ, real-time process monitoring
Huang HT, Terry FL
Thin Solid Films, 455-56, 828, 2004 |
