| 1 |
저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구
권용재, 석종원, Lu JQ, Cale T, Gutmann R
Korean Chemical Engineering Research, 45(5), 466, 2007 |
| 2 |
Texture investigation in Cu damascene interconnects during annealing
Cho JY, Lee HJ, Kim H, Szpunar JA
Materials Science Forum, 495-497, 1377, 2005 |
| 3 |
Orientation and microstructure dependence of electromigration damage in damascene Cu interconnect lines
Mirpuri KK, Szpunar J
Materials Science Forum, 495-497, 1443, 2005 |
| 4 |
New interpretation of the influence of various parameters on texture evolution in damascene Cu interconnect lines
Mirpuri KK, Szpunar J
Materials Science Forum, 495-497, 1449, 2005 |
| 5 |
Texture, microstructure and stress investigations in 0.18 mu m damascene Cu interconnect lines
Mirpuri K, Cho JY, Szpunar J
Materials Science Forum, 426-4, 3551, 2003 |
| 6 |
Electrical characterization of copper interconnects with end-of-roadmap feature sizes
Schindler G, Steinlesberger G, Engelhardt M, Steinhogl W
Solid-State Electronics, 47(7), 1233, 2003 |
