검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding Liu ZY, Cai J, Wang Q, Liu L, Zou GS Applied Surface Science, 445, 16, 2018 |
| 2 |
Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding Lin PC, Chen H, Hsieh HC, Tseng TH, Lee HY, Wu AT Materials Chemistry and Physics, 211, 17, 2018 |
| 3 |
Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics Park M, Baek S, Kim S, Kim SE Applied Surface Science, 324, 168, 2015 |
| 4 |
Interfacial morphology and grain orientation during bumpless direct Cu bonding Liu Z, Cai J, Wang Q Thin Solid Films, 595, 118, 2015 |
| 5 |
Stress analysis of stacked Si wafer in 3D WLP Maeng KH, Kim Y, Kang SG, Kim SD, Kim SE Current Applied Physics, 11(4), S119, 2011 |
| 6 |
3차원 소자 집적을 위한 Cu-Cu 접합의 계면접착에너지에 미치는 후속 열처리의 영향 장은정, Sarah Pfeiffer, Bioh Kim, Thorsten Matthias, 현승민, 이학주, 박영배 Korean Journal of Materials Research, 18(4), 204, 2008 |