| 1 |
The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)
Jin SH, Yoon Y, Jo YG, Lee SY, Moon HS, Seok SH, Kim MJ, Kim JJ, Lee MH
Journal of Industrial and Engineering Chemistry, 96, 376, 2021 |
| 2 |
Revealing the inhibition effect of quaternary ammonium cations on Cu electrodeposition
Jo YE, Yu DY, Cho SK
Journal of Applied Electrochemistry, 50(2), 245, 2020 |
| 3 |
High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS
Lee A, Kim MJ, Choe SH, Kim JJ
Korean Journal of Chemical Engineering, 36(6), 981, 2019 |
| 4 |
Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Chu K, Bae KD, Song BG, Kim J, Park YY, Xianyu W, Lee CS, Sohn Y
Applied Surface Science, 453, 31, 2018 |
| 5 |
Cu seed layer damage caused by insoluble anode in Cu electrodeposition
Ham YS, Cho SK, Kim JJ
Korean Journal of Chemical Engineering, 34(5), 1490, 2017 |
| 6 |
Cyanide removal with a copper/active carbon fiber Cathode via a combined oxidation of a Fenton-like reaction and in situ generated copper oxides at anode
Tian SC, Li YB, Zhao X
Electrochimica Acta, 180, 746, 2015 |
| 7 |
Low-resistivity Cu film electrodeposited with 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonate for the application to the interconnection of electronic devices
Cho SK, Kim MJ, Koo HC, Kwon OJ, Kim JJ
Thin Solid Films, 520(6), 2136, 2012 |
| 8 |
Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
Vervaet A, Siau S, De Baets J, Manirambona B
Applied Surface Science, 252(23), 8243, 2006 |
| 9 |
Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements
Bonou L, Eyraud M, Denoyel R, Massiani Y
Electrochimica Acta, 47(26), 4139, 2002 |
| 10 |
Comparison of the performance of a reactor equipped with a Ti/Pt and an SS anode for simultaneous cyanide removal and copper recovery
Szpyrkowicz L, Kaul SN, Molga E, DeFaveri M
Electrochimica Acta, 46(2-3), 381, 2000 |
