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| No. | Article |
|---|---|
| 1 |
Superconformal filling of 41 nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer Han WK, Hwang GH, Hong SJ, An HH, Yoon CS, Kim JH, Lee MJ, Hong G, Park KS, Kang SG Materials Chemistry and Physics, 123(2-3), 401, 2010 |