화학공학소재연구정보센터
검색결과 : 11건
No. Article
1 Dry release of polymer structures with anti-sticking layer
Cheng MC, Gadre AP, Garra JA, Nijdam AJ, Luo C, Schneider TW, White RC, Currie JF, Paranjape M
Journal of Vacuum Science & Technology A, 22(3), 837, 2004
2 Polymethylmethacry ate membrane for fluid encapsulation and release in microfluidic systems
Srivastava YN, Gadre AP, Hylton T, Monica AH, Schneider TW, White RC, Paranjape M, Currie JF
Journal of Vacuum Science & Technology A, 22(3), 1067, 2004
3 Experimental characterization of the Si/Al/tetramethylammonium hydroxide system
Tashtoush A, Landsberger LM, Essalik A, Kahrizi M, Paranjape M, Currie JF, Pandy A
Journal of the Electrochemical Society, 148(7), C456, 2001
4 Bistable microelectrothermal actuator in a standard complementary metal-oxide-semiconductor process
Ressejac IC, Landsberger LM, Currie JF
Journal of Vacuum Science & Technology A, 18(2), 746, 2000
5 Effect of in situ plasma oxidation of TiN diffusion barrier for AlSiCu/TiN/Ti metallization structure of integrated circuits
Fortin V, Gujrathi SC, Gagnon G, Gauvin R, Currie JF, Ouellet L, Tremblay Y
Journal of Vacuum Science & Technology B, 17(2), 423, 1999
6 Band alignment and barrier height considerations for the quantum-confined Stark effect
Yip RYF, Desjardins P, Isnard L, Ait-Ouali A, Bensaada A, Marchand H, Brebner JL, Currie JF, Masut RA
Journal of Vacuum Science & Technology A, 16(2), 801, 1998
7 Novel simple and complementary metal-oxide-semiconductor-compatible membrane release design and process for thermal sensors
Leclerc S, Antaki R, Currie JF
Journal of Vacuum Science & Technology A, 16(2), 876, 1998
8 Electron cyclotron resonance plasma chemical vapor deposited silicon nitride for micromechanical applications
Leclerc S, Lecours A, Caron M, Richard E, Turcotte G, Currie JF
Journal of Vacuum Science & Technology A, 16(2), 881, 1998
9 The Effect of the Ti Glue Layer in an Integrated Ti/Tin/Ti/Alsicu/Tin Contact Metallization Process
Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M
Journal of Vacuum Science & Technology B, 14(4), 2627, 1996
10 Effect of the Ti/Tin Bilayer Barrier and Its Surface-Treatment on the Reliability of a Ti/Tin/Alsicu/Tin Contact Metallization
Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M
Journal of Vacuum Science & Technology B, 14(6), 3502, 1996