| 1 |
Investigation on curing characterization of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis
Lee DE, Cho HJ, Kong BS, Choi HO
Thermochimica Acta, 674, 68, 2019 |
| 2 |
Design and Fabrication of a Shielded Interdigital Sensor for Noninvasive In Situ Real-Time Production Monitoring of Polymers
Yang Y, Chiesura G, Vervust T, Degrieck J, Vanfleteren J
Journal of Polymer Science Part B: Polymer Physics, 54(20), 2028, 2016 |
| 3 |
Cure state assessment of EVA-copolymers for PV-applications comparing dynamic-mechanical, dielectric and calorimetric properties
Schulze SH, Apel A, Dassler D, Ehrich C
Solar Energy Materials and Solar Cells, 143, 411, 2015 |
| 4 |
Evaluation of the crosslinking reaction kinetics of cationic polyol dispersions with differential scanning calorimetry and dielectric analysis
Wu GM, Kong ZW, Chen CF, Chen J, Huo SP, Jiang JC
Thermochimica Acta, 551, 118, 2013 |
| 5 |
Electrode-spacer and other effects on the validity of the Kramers-Kronig relations and the fittings to the permittivity and electrical modulus spectra
Johari GP
Thermochimica Acta, 547, 47, 2012 |
| 6 |
Coupling of dielectric and mechanical relaxations with glass transition and stickiness of milk solids
Silalai N, Roos YH
Journal of Food Engineering, 104(3), 445, 2011 |
| 7 |
Dielectric analysis of poly(methyl methacrylate) zinc(II) mono-pinacolborane diphenylporphyrin composites
Hilker B, Fields KB, Stern A, Space B, Zhang XP, Harmon JP
Polymer, 51(21), 4790, 2010 |
| 8 |
Dielectric properties and EMI shielding efficiency of polyaniline and ethylene 1-octene based semi-conducting composites
Bhadra S, Singha NK, Khastgir D
Current Applied Physics, 9(2), 396, 2009 |
| 9 |
Radiation effects on dielectric properties of ethylene propylene rubber
Lee C, Lee KB
Journal of Industrial and Engineering Chemistry, 14(4), 473, 2008 |
| 10 |
Dielectric analysis of chitosan gel beads suspensions: Influence of low crosslinking agent concentration on the dielectric behavior
Ni N, Zhao KS
Journal of Colloid and Interface Science, 312(2), 256, 2007 |
