검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Curing of low level melamine-modified urea-formaldehyde particleboard binder resins studied with dynamic mechanical analysis (DMA) No BY, Kim MG Journal of Applied Polymer Science, 97(1), 377, 2005 |
| No. | Article |
|---|---|
| 1 |
Curing of low level melamine-modified urea-formaldehyde particleboard binder resins studied with dynamic mechanical analysis (DMA) No BY, Kim MG Journal of Applied Polymer Science, 97(1), 377, 2005 |