| 1 |
Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical-Mechanical Planarization of silica surfaces
Volkov DO, Dandu PRV, Goodman H, Santora B, Sokolov I
Applied Surface Science, 257(20), 8518, 2011 |
| 2 |
Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions
Dandu PRV, Peethala BC, Amanapu HP, Babu SV
Journal of the Electrochemical Society, 158(8), H763, 2011 |
| 3 |
Reverse selectivity - High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions
Dandu PRV, Devarapalli VK, Babu SV
Journal of Colloid and Interface Science, 347(2), 267, 2010 |
| 4 |
Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films
Dandu PRV, Penta NK, Peethala BC, Babu SV
Journal of Colloid and Interface Science, 348(1), 114, 2010 |
| 5 |
Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions
Dandu PRV, Peethala BC, Babu SV
Journal of the Electrochemical Society, 157(9), II869, 2010 |
