검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 518(14), 3903, 2010 |
| 2 |
A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 518(14), 3910, 2010 |
| 3 |
Analysis of pads with slanted grooves for copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Philipossian A Journal of the Electrochemical Society, 155(10), H750, 2008 |
| 4 |
Design and evaluation of pad grooves for copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Philipossian A Journal of the Electrochemical Society, 155(10), H797, 2008 |
| 5 |
Evaluation of pad groove designs under reduced slurry flow rate conditions during copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Sampurno Y, Philipossian A Journal of the Electrochemical Society, 155(10), H812, 2008 |
| 6 |
Modeling copper CMP removal rate dependency on wafer pressure, velocity, and dissolved oxygen concentration DeNardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A Journal of the Electrochemical Society, 153(5), G428, 2006 |
| 7 |
Characterization of copper-hydrogen peroxide film growth kinetics DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 513(1-2), 311, 2006 |
| 8 |
Impact of gaseous additives on copper CMP in neutral and alkaline solutions using a CAP system DeNardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A Journal of the Electrochemical Society, 152(11), G824, 2005 |
| 9 |
Arrhenius characterization of ILD and copper CMP processes Sorooshian J, DeNardis D, Charns L, Li Z, Shadman F, Boning D, Hetherington D, Philipossiana A Journal of the Electrochemical Society, 151(2), G85, 2004 |