검색결과 : 8건
No. | Article |
---|---|
1 |
The oncoprotein HBXIP up-regulates FGF4 through activating transcriptional factor Sp1 to promote the migration of breast cancer cells Shi H, Li YH, Feng GX, Li LL, Fang RP, Wang Z, Qu J, Ding PJ, Zhang XD, Ye LH Biochemical and Biophysical Research Communications, 471(1), 89, 2016 |
2 |
Study of metal gate deposition by magnetron sputtering Ye MQ, Liu ZD, Ding PJ, Hung S, Ahmed K Journal of Vacuum Science & Technology B, 24(5), 2214, 2006 |
3 |
The effect of oxygen in the annealing ambient on interfacial reactions of Cu/Ta/Si multilayers Yin KM, Chang L, Chen FR, Kai JJ, Chiang CC, Ding PJ, Chin B, Zhang H, Chen FS Thin Solid Films, 388(1-2), 15, 2001 |
4 |
Oxidation of Ta diffusion barrier layer for Cu metallization in thermal annealing Yin KM, Chang L, Chen FR, Kai JJ, Chiang CC, Chuang G, Ding PJ, Chin B, Zhang H, Chen FS Thin Solid Films, 388(1-2), 27, 2001 |
5 |
Deposition of copper by using self-sputtering Fu JM, Ding PJ, Dorleans F, Xu Z, Chen FS Journal of Vacuum Science & Technology A, 17(5), 2830, 1999 |
6 |
Passivation of copper by low temperature annealing of Cu/Mg/SiO2 bilayers Wang W, Ding PJ, Hymes S, Murarka SP, Lanford WA Chemical Engineering Communications, 153, 253, 1996 |
7 |
Determination of the Lateral Spread of Xe Ions in Silicon-Nitride and Hydrated Silicon-Nitride Films by Oblique-Incidence Rutherford Backscattering Wang KM, Qu BD, Shi BR, Lu F, Meng MQ, Wang ZL, Wang W, Ding PJ Journal of Vacuum Science & Technology A, 14(1), 240, 1996 |
8 |
Low-Temperature Passivation of Copper by Doping with Al or Mg Lanford WA, Ding PJ, Wang W, Hymes S, Muraka SP Thin Solid Films, 262(1-2), 234, 1995 |