| 1 |
Application of three different methods to determine the prevalence, the abundance and the environmental drivers of culturable Vibrio cholerae in fresh and brackish bathing waters
Kirschner AKT, Pleininger S, Jakwerth S, Rehak S, Farnleitner AH, Huhulescu S, Indra A
Journal of Applied Microbiology, 125(4), 1186, 2018 |
| 2 |
Evaluation of different conditions and culture media for the recovery of Aeromonas spp. from water and shellfish samples
Latif-Eugenin F, Beaz-Hidalgo R, Figueras MJ
Journal of Applied Microbiology, 121(3), 883, 2016 |
| 3 |
The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating
Nagar M, Radisic A, Strubbe K, Vereecken PM
Electrochimica Acta, 127, 315, 2014 |
| 4 |
The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates
Nagar M, Radisic A, Strubbe K, Vereecken PM
Electrochimica Acta, 92, 474, 2013 |
| 5 |
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang L, Radisic A, Nagar M, Deconinck J, Vereecken PM, West AC
Electrochimica Acta, 78, 524, 2012 |
| 6 |
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects
Eom TK, Sari W, Cheon T, Kim SH, Kim WK
Thin Solid Films, 521, 73, 2012 |
| 7 |
Substrate temperature dependence of electrical and structural properties of Ru films
Nagano T, Inokuchi K, Tamahashi K, Ishikawa N, Sasajima Y, Onuki J
Thin Solid Films, 520(1), 374, 2011 |
| 8 |
Process of direct copper plating on ABS plastics
Wang GX, Li N, Hu HL, Yu YC
Applied Surface Science, 253(2), 480, 2006 |
| 9 |
Ni-P-SiC composite produced by pulse and direct current plating
Hou KH, Hwu WH, Ke ST, Ger MD
Materials Chemistry and Physics, 100(1), 54, 2006 |
