| 1 |
Kinetics of titania nanotube formation by anodization of titanium films
Butail G, Ganesan PG, Raddiar M, Teki R, Ravishankar N, Duquette DJ, Ramanath G
Thin Solid Films, 519(6), 1821, 2011 |
| 2 |
Branched titania nanotubes through anodization voltage control
Butail G, Ganesan PG, Teki R, Mahima R, Ravishankar N, Duquette DJ, Ramanath G
Thin Solid Films, 520(1), 235, 2011 |
| 3 |
Quantitative measurement of interfacial adhesion between seedless electrodeposited copper and tantalum-based diffusion barriers for microelectronics
Kim S, Duquette DJ
Electrochemical and Solid State Letters, 10(1), D6, 2007 |
| 4 |
Direct plating of Cu on Pd plasma enhanced atomic layer deposition coated TaN barrier
Lay NE, Eyck GAT, Duquette DJ, Lu TM
Electrochemical and Solid State Letters, 10(1), D13, 2007 |
| 5 |
Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes
Kim S, Jang JH, Lee JS, Duquette DJ
Electrochimica Acta, 52(16), 5258, 2007 |
| 6 |
Morphology control of copper growth on TiN and TaN diffusion barriers in seedless copper electrodeposition
Kim S, Duquette DJ
Journal of the Electrochemical Society, 154(4), D195, 2007 |
| 7 |
Multiple bath usage for adhesion enhancement of directly electrodeposited copper on TaN
Kim SJ, Duquette DJ
Electrochemical and Solid State Letters, 9(2), C38, 2006 |
| 8 |
Effect of chemical composition on adhesion of directly electrodeposited copper film on TiN
Kim S, Duquette DJ
Journal of the Electrochemical Society, 153(6), C417, 2006 |
| 9 |
Nucleation characteristics of directly electrodeposited copper on TiN
Kim S, Duquette DJ
Journal of the Electrochemical Society, 153(9), C673, 2006 |
| 10 |
Nucleation and growth of electrochemically deposited copper on TiN and copper from a Cu-NH3 bath
Graham L, Steinbruchel C, Duquette DJ
Journal of the Electrochemical Society, 149(8), C390, 2002 |
