| 1 |
Effect of evaporated copper and aluminum on post-annealed SiOC(-H) films deposited using plasma-enhanced chemical vapor deposition
Kim CY, Lee HS, Navamathavan R, Woo JK, Choi CK
Thin Solid Films, 518(22), 6469, 2010 |
| 2 |
Repeating of positive and negative high electric field stress and corresponding thermal post-stress annealing of the n-channel power VDMOSFETs
Aleksic SM, Jaksic AB, Pejovic MM
Solid-State Electronics, 52(8), 1197, 2008 |
| 3 |
Defect behaviors in n-channel power VDMOSFETs during HEFS and thermal post-HEFS annealing
Ristic GS, Pejovic MM, Jaksic AB
Applied Surface Science, 252(8), 3023, 2006 |
| 4 |
Fowler-Nordheim high electric field stress of power VDMOSFETs
Ristic GS, Pejovic MM, Jaksic AB
Solid-State Electronics, 49(7), 1140, 2005 |
| 5 |
Comparison between post-irradiation annealing and post-high electric field stress annealing of n-channel power VDMOSFETs
Ristic GS, Pejovic MM, Jaksic AB
Applied Surface Science, 220(1-4), 181, 2003 |
| 6 |
Effect of osmotic pretreatment and pulsed electric field on the viscoelastic properties of potato tissue
Fincan M, Dejmek P
Journal of Food Engineering, 59(2-3), 169, 2003 |
