화학공학소재연구정보센터
검색결과 : 14건
No. Article
1 Selected fundamentals of catalysis and electrocatalysis in energy conversion reactions-A tutorial
Roduner E
Catalysis Today, 309, 263, 2018
2 Optimal process parameters for phosphorus spin-on-doping of germanium
Boldrini V, Carturan SM, Maggioni G, Napolitani E, Napoli DR, Camattari R, De Salvador D
Applied Surface Science, 392, 1173, 2017
3 A study on the electrical activation behavior of boron in Si thin film doped by IMD
Lee YW, Lee SJ, Yun SJ, Joo SK
Current Applied Physics, 11(4), S158, 2011
4 Electrical activation in boron doped polycrystalline Si formed by sequential lateral solidification
Hong WE, Kim DH, Kim CW, Ro JS
Thin Solid Films, 520(1), 616, 2011
5 Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology
Nguyen ND, Rosseel E, Takeuchi S, Everaert JL, Yang L, Goossens J, Moussa A, Clarysse T, Richard O, Bender H, Zaima S, Sakai A, Loo R, Lin JC, Vandervorst W, Caymax M
Thin Solid Films, 518, S48, 2010
6 The solubility and defect equilibrium of the n-type dopants nitrogen and phosphorus in 4H-SiC: a theoretical study
Bockstedte M, Mattausch A, Pankratov O
Materials Science Forum, 457-460, 715, 2004
7 A comparative study of high-temperature aluminum post-implantation annealing in 6H-and 4H-SiC, non-uniform temperature effects
Lazar M, Raynaud C, Planson D, Locatelli ML, Isoird K, Ottaviani L, Chante JP, Nipoti R, Poggi A, Cardinali G
Materials Science Forum, 389-3, 827, 2002
8 Electrical activation of ion-implanted nitrogen and aluminum in 4H-SiC by excimer laser annealing
Tanaka Y, Tanoue H, Arai K
Materials Science Forum, 433-4, 605, 2002
9 High electrical activation of aluminium and nitrogen implanted in 6H-SiC at room temperature by RF annealing
Lazar M, Ottaviani L, Locatelli ML, Raynaud C, Planson D, Morvan E, Godignon P, Skorupa W, Chantel JP
Materials Science Forum, 353-356, 571, 2001
10 Enhancement of electrical activation of aluminum accepters in 6H-SiC by co-implantation of carbon ions
Ohshima T, Itoh H, Yoshikawa M
Materials Science Forum, 353-356, 575, 2001