검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization Jeong S, Lee S, Park B, Kim H, Kim S, Jeong H Current Applied Physics, 10(1), 299, 2010 |
| No. | Article |
|---|---|
| 1 |
Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization Jeong S, Lee S, Park B, Kim H, Kim S, Jeong H Current Applied Physics, 10(1), 299, 2010 |