검색결과 : 1건
No. | Article |
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1 |
Enhancing the efficiency of postetch polymer removal using megasonic wet clean for 0.13-mu m dual damascene interconnect process Chang CK, Foo TH, Murkherjee-Roy M, Bliznetov VN, Li HY Thin Solid Films, 462-63, 292, 2004 |