검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections Osborn T, Galiba N, Kohl PA Journal of the Electrochemical Society, 156(7), D226, 2009 |
| 2 |
All-copper chip-to-substrate interconnects - Part I. Fabrication and characterization Osborn T, He A, Galiba N, Kohl PA Journal of the Electrochemical Society, 155(4), D308, 2008 |