검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Study of the Copper Reflow Process Using the Grofilms Simulator Friedrich LJ, Gardner DS, Dew SK, Brett MJ, Smy T Journal of Vacuum Science & Technology B, 15(5), 1780, 1997 |
| 2 |
Encapsulated Copper Interconnection Devices Using Sidewall Barriers Gardner DS, Onuki J, Kudoo K, Misawa Y, Vu QT Thin Solid Films, 262(1-2), 104, 1995 |