검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Chemical-Vapor-Deposited Ticn - A New Barrier Metallization for Submicron via and Contact Applications Eizenberg M, Littau K, Ghanayem S, Liao M, Mosely R, Sinha AK Journal of Vacuum Science & Technology A, 13(3), 590, 1995 |