화학공학소재연구정보센터
검색결과 : 22건
No. Article
1 Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
Jung KW, Kharangate CR, Lee H, Palko J, Zhou F, Asheghi M, Dede EM, Goodson KE
International Journal of Heat and Mass Transfer, 130, 1108, 2019
2 Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa
Kong D, Jung KW, Jung S, Jung D, Schaadt J, Lyengar M, Malone C, Kharangate CR, Asheghi M, Goodson KE, Lee H
International Journal of Heat and Mass Transfer, 141, 145, 2019
3 Porous micropillar structures for retaining low surface tension liquids
Agonafer DD, Lee H, Vasquez PA, Won Y, Jung KW, Lingamneni S, Ma BJ, Shan L, Shuai S, Du ZC, Maitra T, Palko JW, Goodson KE
Journal of Colloid and Interface Science, 514, 316, 2018
4 A method for quantifying in plane permeability of porous thin films
Rong GG, Palko JW, Oyarzun DI, Zhang C, Hammerle J, Asheghi M, Goodson KE, Santiago JG
Journal of Colloid and Interface Science, 530, 667, 2018
5 Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
Barako MT, English TS, Roy-Panzer S, Kenny TW, Goodson KE
Thin Solid Films, 649, 24, 2018
6 Modulation of thermal and thermoelectric transport in individual carbon nanotubes by fullerene encapsulation
Kodama T, Ohnishi M, Park W, Shiga T, Park J, Shimada T, Shinohara H, Shiomi J, Goodson KE
Nature Materials, 16(9), 892, 2017
7 Power density optimization for micro thermoelectric generators
Dunham MT, Barako MT, LeBlanc S, Asheghi M, Chen BX, Goodson KE
Energy, 93, 2006, 2015
8 Burst behavior at a capillary tip: Effect of low and high surface tension
Agonafer DD, Lopez K, Palko JW, Won Y, Santiago JG, Goodson KE
Journal of Colloid and Interface Science, 455, 1, 2015
9 THERMAL TRANSPORT Cool electronics
Cho JW, Goodson KE
Nature Materials, 14(2), 136, 2015
10 Temperature-dependent aggregation and diffusion in nanofluids
Gharagozloo PE, Goodson KE
International Journal of Heat and Mass Transfer, 54(4), 797, 2011