검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Use of slurry colloidal behavior in modeling of material removal rates for copper CMP Gopal T, Talbot JB Journal of the Electrochemical Society, 154(6), H507, 2007 |
| 2 |
Effects of CMP slurry chemistry on the zeta potential of alumina abrasives Gopal T, Talbot JB Journal of the Electrochemical Society, 153(7), G622, 2006 |