검색결과 : 39건
No. | Article |
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1 |
Extending the Lifetime of Organic Flow Batteries via Redox State Management Goulet MA, Tong LC, Pollack DA, Tabor DP, Odom SA, Aspuru-Guzik A, Kwan EE, Gordon RG, Aziz MJ Journal of the American Chemical Society, 141(20), 8014, 2019 |
2 |
Alkaline quinone flow battery Lin KX, Chen Q, Gerhardt MR, Tong LC, Kim SB, Eisenach L, Valle AW, Hardee D, Gordon RG, Aziz MJ, Marshak MP Science, 349(6255), 1529, 2015 |
3 |
Atomic Layer Deposited Gallium Oxide Buffer Layer Enables 1.2 V Open-Circuit Voltage in Cuprous Oxide Solar Cells Lee YS, Chua D, Brandt RE, Siah SC, Li JV, Mailoa JP, Lee SW, Gordon RG, Buonassisi T Advanced Materials, 26(27), 4704, 2014 |
4 |
3.88% Efficient Tin Sulfide Solar Cells using Congruent Thermal Evaporation Steinmann V, Jaramillo R, Hartman K, Chakraborty R, Brandt RE, Poindexter JR, Lee YS, Sun LZ, Polizzotti A, Park HH, Gordon RG, Buonassisi T Advanced Materials, 26(44), 7488, 2014 |
5 |
A metal-free organic-inorganic aqueous flow battery Huskinson B, Marshak MP, Suh C, Er S, Gerhardt MR, Galvin CJ, Chen XD, Aspuru-Guzik A, Gordon RG, Aziz MJ Nature, 505(7482), 195, 2014 |
6 |
Glass-Encapsulated Light Harvesters: More Efficient Dye-Sensitized Solar Cells by Deposition of Self-Aligned, Conformal, and Self-Limited Silica Layers Son HJ, Wang XW, Prasittichai C, Jeong NC, Aaltonen T, Gordon RG, Hupp JT Journal of the American Chemical Society, 134(23), 9537, 2012 |
7 |
Vapor Deposition of Highly Conformal Copper Seed Layers for Plating Through-Silicon Vias (TSVs) Au Y, Wang QM, Li HZ, Lehn JSM, Shenai DV, Gordon RG Journal of the Electrochemical Society, 159(6), D382, 2012 |
8 |
Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers Au Y, Lin YB, Gordon RG Journal of the Electrochemical Society, 158(5), D248, 2011 |
9 |
Low Temperature Epitaxial Growth of High Permittivity Rutile TiO2 on SnO2 Wang HT, Xu S, Gordon RG Electrochemical and Solid State Letters, 13(9), G75, 2010 |
10 |
Selective Chemical Vapor Deposition of Manganese Self-Aligned Capping Layer for Cu Interconnections in Microelectronics Au Y, Lin YB, Kim H, Beh E, Liu YQ, Gordon RG Journal of the Electrochemical Society, 157(6), D341, 2010 |