화학공학소재연구정보센터
검색결과 : 39건
No. Article
1 Extending the Lifetime of Organic Flow Batteries via Redox State Management
Goulet MA, Tong LC, Pollack DA, Tabor DP, Odom SA, Aspuru-Guzik A, Kwan EE, Gordon RG, Aziz MJ
Journal of the American Chemical Society, 141(20), 8014, 2019
2 Alkaline quinone flow battery
Lin KX, Chen Q, Gerhardt MR, Tong LC, Kim SB, Eisenach L, Valle AW, Hardee D, Gordon RG, Aziz MJ, Marshak MP
Science, 349(6255), 1529, 2015
3 Atomic Layer Deposited Gallium Oxide Buffer Layer Enables 1.2 V Open-Circuit Voltage in Cuprous Oxide Solar Cells
Lee YS, Chua D, Brandt RE, Siah SC, Li JV, Mailoa JP, Lee SW, Gordon RG, Buonassisi T
Advanced Materials, 26(27), 4704, 2014
4 3.88% Efficient Tin Sulfide Solar Cells using Congruent Thermal Evaporation
Steinmann V, Jaramillo R, Hartman K, Chakraborty R, Brandt RE, Poindexter JR, Lee YS, Sun LZ, Polizzotti A, Park HH, Gordon RG, Buonassisi T
Advanced Materials, 26(44), 7488, 2014
5 A metal-free organic-inorganic aqueous flow battery
Huskinson B, Marshak MP, Suh C, Er S, Gerhardt MR, Galvin CJ, Chen XD, Aspuru-Guzik A, Gordon RG, Aziz MJ
Nature, 505(7482), 195, 2014
6 Glass-Encapsulated Light Harvesters: More Efficient Dye-Sensitized Solar Cells by Deposition of Self-Aligned, Conformal, and Self-Limited Silica Layers
Son HJ, Wang XW, Prasittichai C, Jeong NC, Aaltonen T, Gordon RG, Hupp JT
Journal of the American Chemical Society, 134(23), 9537, 2012
7 Vapor Deposition of Highly Conformal Copper Seed Layers for Plating Through-Silicon Vias (TSVs)
Au Y, Wang QM, Li HZ, Lehn JSM, Shenai DV, Gordon RG
Journal of the Electrochemical Society, 159(6), D382, 2012
8 Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers
Au Y, Lin YB, Gordon RG
Journal of the Electrochemical Society, 158(5), D248, 2011
9 Low Temperature Epitaxial Growth of High Permittivity Rutile TiO2 on SnO2
Wang HT, Xu S, Gordon RG
Electrochemical and Solid State Letters, 13(9), G75, 2010
10 Selective Chemical Vapor Deposition of Manganese Self-Aligned Capping Layer for Cu Interconnections in Microelectronics
Au Y, Lin YB, Kim H, Beh E, Liu YQ, Gordon RG
Journal of the Electrochemical Society, 157(6), D341, 2010