검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications Kumar S, Greenslit D, Chakraborty T, Eisenbraun ET Journal of Vacuum Science & Technology A, 27(3), 572, 2009 |
| 2 |
Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications Greenslit D, Chakraborty T, Eisenbraun E Journal of Vacuum Science & Technology B, 27(2), 631, 2009 |