화학공학소재연구정보센터
검색결과 : 2건
No. Article
1 Comparison of electromigration in cu interconnects with atomic-layer-or physical-vapor-deposited TaN liners
Hu CK, Gignac L, Liniger E, Grunow S, Demarest JJ, Redder B, Simon A, Liew SL
Journal of the Electrochemical Society, 154(9), H755, 2007
2 Using sputter deposition to increase CO tolerance in a proton-exchange membrane fuel cell
Haug AT, White RE, Weidner JW, Huang W, Shi S, Rana N, Grunow S, Stoner TC, Kaloyeros AE
Journal of the Electrochemical Society, 149(7), A868, 2002