검색결과 : 2건
No. | Article |
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1 |
Comparison of electromigration in cu interconnects with atomic-layer-or physical-vapor-deposited TaN liners Hu CK, Gignac L, Liniger E, Grunow S, Demarest JJ, Redder B, Simon A, Liew SL Journal of the Electrochemical Society, 154(9), H755, 2007 |
2 |
Using sputter deposition to increase CO tolerance in a proton-exchange membrane fuel cell Haug AT, White RE, Weidner JW, Huang W, Shi S, Rana N, Grunow S, Stoner TC, Kaloyeros AE Journal of the Electrochemical Society, 149(7), A868, 2002 |