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| No. | Article |
|---|---|
| 1 |
Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection Bairi A, Haddad O, Guinart JP, Adeyeye K, Alilat N Heat Transfer Engineering, 39(4), 353, 2018 |