검색결과 : 8건
No. | Article |
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1 |
Oxygen incorporation and charge donor activation via subplantation during growth of indium tin oxide films Amassian A, Dudek M, Zabeida O, Gujrathi SC, Klemberg-Sapieha JE, Martinu L Journal of Vacuum Science & Technology A, 27(2), 362, 2009 |
2 |
Optical and electrical characterization of OMVPE-grown AlGaAsSb epitaxial layers on InP substrates Rao TS, So MG, Jiang WY, Mayer T, Roorda S, Gujrathi SC, Thewalt MLW, Bolognesi CR, Watkins SP Journal of Crystal Growth, 287(2), 532, 2006 |
3 |
Microstructure of plasma-deposited SiO2/TiO2 optical films Larouche S, Szymanowski H, Klemberg-Sapieha JE, Martinu L, Gujrathi SC Journal of Vacuum Science & Technology A, 22(4), 1200, 2004 |
4 |
Influence of substrate bias voltage on the properties of CNx films prepared by reactive magnetron sputtering Hajek V, Rusnak K, Vlcek J, Martinu L, Gujrathi SC Journal of Vacuum Science & Technology A, 17(3), 899, 1999 |
5 |
Effect of in situ plasma oxidation of TiN diffusion barrier for AlSiCu/TiN/Ti metallization structure of integrated circuits Fortin V, Gujrathi SC, Gagnon G, Gauvin R, Currie JF, Ouellet L, Tremblay Y Journal of Vacuum Science & Technology B, 17(2), 423, 1999 |
6 |
Plasma-deposited silicon oxide and silicon nitride films on poly(ethylene terephthalate) : A multitechnique study of the interphase regions Sobrinho ASD, Schuhler N, Klemberg-Sapieha JE, Wertheimer MR, Andrews M, Gujrathi SC Journal of Vacuum Science & Technology A, 16(4), 2021, 1998 |
7 |
The Effect of the Ti Glue Layer in an Integrated Ti/Tin/Ti/Alsicu/Tin Contact Metallization Process Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M Journal of Vacuum Science & Technology B, 14(4), 2627, 1996 |
8 |
Effect of the Ti/Tin Bilayer Barrier and Its Surface-Treatment on the Reliability of a Ti/Tin/Alsicu/Tin Contact Metallization Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M Journal of Vacuum Science & Technology B, 14(6), 3502, 1996 |