검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy Lee JB, Lee JG, Ha SS, Jung SB Journal of Adhesion Science and Technology, 25(18), 2475, 2011 |
| 2 |
Effect of the resistance-area product on the temperature increase of nanopillar for spin torque magnetic memory Ha SS, Lee KJ, You CY Current Applied Physics, 10(2), 659, 2010 |
| 3 |
Interfacial reaction and joint strength on CuUBM with Pb-free flip chip solder bumps Kim DG, Ha SS, Jung SB Materials Science Forum, 510-511, 550, 2006 |