검색결과 : 12건
| No. | Article |
|---|---|
| 1 |
Copolymers of Imidazole and 1,4-Butandiol Diglycidyl Ether as an Efficient Suppressor Additive for Copper Electroplating Hai NTM, Furrer J, Barletta E, Luedi N, Broekmann P Journal of the Electrochemical Society, 161(9), D381, 2014 |
| 2 |
On the role of halides and thiols in additive-assisted copper electroplating Huynh TMT, Weiss F, Hai NTM, Reckien W, Bredow T, Fluegel A, Arnold M, Mayer D, Keller H, Broekmann P Electrochimica Acta, 89, 537, 2013 |
| 3 |
Polyvinylpyrrolidones (PVPs): Switchable Leveler Additives for Damascene Applications Hai NTM, Furrer J, Stricker F, Huynh TMT, Gjuroski I, Luedi N, Brunner T, Weiss F, Fluegel A, Arnold M, Chang I, Mayer D, Broekmann P Journal of the Electrochemical Society, 160(12), D3116, 2013 |
| 4 |
On the Acceleration of Cu Electrodeposition by TBPS (3,3-thiobis-1-propanesulfonic acid): A Combined Electrochemical, STM, NMR, ESI-MS and DFT Study Hai NTM, Furrer J, Gjuroski I, Bircher MP, Cascella M, Broekmann P Journal of the Electrochemical Society, 160(12), D3158, 2013 |
| 5 |
Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM Huynh TMT, Hai NTM, Broekmann P Journal of the Electrochemical Society, 160(12), D3063, 2013 |
| 6 |
Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P Electrochimica Acta, 70, 286, 2012 |
| 7 |
Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating Hai NTM, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P Electrochimica Acta, 83, 367, 2012 |
| 8 |
Classification of suppressor additives based on synergistic and antagonistic ensemble effects Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D Electrochimica Acta, 56(13), 4724, 2011 |
| 9 |
Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies Hai NTM, Huynh TMT, Fluegel A, Mayer D, Broekmann P Electrochimica Acta, 56(21), 7361, 2011 |
| 10 |
Copper dissolution in the presence of a binary 2D-compound: CuI on Cu(100) Broekmann P, Hai NTM, Wandelt K Journal of Applied Electrochemistry, 36(11), 1241, 2006 |