검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips Harendt C, Kostelnik J, Kugler A, Lorenz E, Saller S, Schreivogel A, Yu ZL, Burghartz JN Solid-State Electronics, 113, 101, 2015 |
| 2 |
Thermal characterization and modeling of ultra-thin silicon chips Alshahed M, Yu ZL, Rempp H, Richter H, Harendt C, Burghartz JN Solid-State Electronics, 113, 121, 2015 |
| 3 |
Compensation of externally applied mechanical stress by stacking of ultrathin chips Endler S, Rempp H, Harendt C, Burghartz JN Solid-State Electronics, 74, 102, 2012 |
| 4 |
Ultra-thin chip technology and applications, a new paradigm in silicon technology Burghartz JN, Appel W, Harendt C, Rempp H, Richter H, Zimmermann M Solid-State Electronics, 54(9), 818, 2010 |