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Human reliability assessment for complex physical operations in harsh operating conditions Golestani N, Abbassi R, Garaniya V, Asadnia M, Khan F Process Safety and Environmental Protection, 140, 1, 2020 |
2 |
Multilayer protective coatings obtained by pulsed laser deposition Ion V, Scarisoreanu ND, Bonciu A, Moldovan A, Ghenescu V, Ghenescu M, Banciu MG, Andrei A, Dinescu M Applied Surface Science, 479, 1124, 2019 |
3 |
High-temperature reliability of Ni/Nb ohmic contacts on 4H-SiC for harsh environment applications Cuong VV, Ishikawa S, Maeda T, Sezaki H, Yasuno S, Koganezawa T, Miyazaki T, Kuroki SI Thin Solid Films, 669, 306, 2019 |
4 |
Energy conversion and ignition of fluffy graphene by flash light Liu GN, Liu D, Zhu JW, Wei JL, Cui W, Li SQ Energy, 144, 669, 2018 |
5 |
Coupled cooling method for multiple latent heat thermal storage devices combined with pre-cooling of envelope: Model development and operation optimization Gao XK, Zhang ZJ, Yuan YP, Cao XL, Zeng C, Yan D Energy, 159, 508, 2018 |
6 |
Investigation of solar PV performance under Doha weather using a customized measurement and monitoring system Touati F, Al-Hitmi MA, Chowdhury NA, Abu Hamad J, Gonzales AJRSP Renewable Energy, 89, 564, 2016 |
7 |
Multimedia fate modeling of oil spills in ice-infested waters: An exploration of the feasibility of fugacity-based approach Yang M, Khan F, Garaniya V, Chai S Process Safety and Environmental Protection, 93, 206, 2015 |
8 |
Amorphous silicon carbide thin films (a-SiC:H) deposited by plasma-enhanced chemical vapor deposition as protective coatings for harsh environment applications Daves W, Krauss A, Behnel N, Haublein V, Bauer A, Frey L Thin Solid Films, 519(18), 5892, 2011 |
9 |
Ambient temperature characteristics of Schottky contacts on 4H-SiC aged in air at 350 degrees C Adedeji AV, Ahyi AC, Williams JR, Mohney SE, Scofield JD Solid-State Electronics, 54(7), 736, 2010 |
10 |
Study of TiW/Au thin films as metallization stack for high temperature and harsh environment devices on 6H Silicon Carbide Baeri A, Raineri V, Roccaforte F, La Via F, Zanetti E Materials Science Forum, 457-460, 873, 2004 |