화학공학소재연구정보센터
검색결과 : 10건
No. Article
1 Human reliability assessment for complex physical operations in harsh operating conditions
Golestani N, Abbassi R, Garaniya V, Asadnia M, Khan F
Process Safety and Environmental Protection, 140, 1, 2020
2 Multilayer protective coatings obtained by pulsed laser deposition
Ion V, Scarisoreanu ND, Bonciu A, Moldovan A, Ghenescu V, Ghenescu M, Banciu MG, Andrei A, Dinescu M
Applied Surface Science, 479, 1124, 2019
3 High-temperature reliability of Ni/Nb ohmic contacts on 4H-SiC for harsh environment applications
Cuong VV, Ishikawa S, Maeda T, Sezaki H, Yasuno S, Koganezawa T, Miyazaki T, Kuroki SI
Thin Solid Films, 669, 306, 2019
4 Energy conversion and ignition of fluffy graphene by flash light
Liu GN, Liu D, Zhu JW, Wei JL, Cui W, Li SQ
Energy, 144, 669, 2018
5 Coupled cooling method for multiple latent heat thermal storage devices combined with pre-cooling of envelope: Model development and operation optimization
Gao XK, Zhang ZJ, Yuan YP, Cao XL, Zeng C, Yan D
Energy, 159, 508, 2018
6 Investigation of solar PV performance under Doha weather using a customized measurement and monitoring system
Touati F, Al-Hitmi MA, Chowdhury NA, Abu Hamad J, Gonzales AJRSP
Renewable Energy, 89, 564, 2016
7 Multimedia fate modeling of oil spills in ice-infested waters: An exploration of the feasibility of fugacity-based approach
Yang M, Khan F, Garaniya V, Chai S
Process Safety and Environmental Protection, 93, 206, 2015
8 Amorphous silicon carbide thin films (a-SiC:H) deposited by plasma-enhanced chemical vapor deposition as protective coatings for harsh environment applications
Daves W, Krauss A, Behnel N, Haublein V, Bauer A, Frey L
Thin Solid Films, 519(18), 5892, 2011
9 Ambient temperature characteristics of Schottky contacts on 4H-SiC aged in air at 350 degrees C
Adedeji AV, Ahyi AC, Williams JR, Mohney SE, Scofield JD
Solid-State Electronics, 54(7), 736, 2010
10 Study of TiW/Au thin films as metallization stack for high temperature and harsh environment devices on 6H Silicon Carbide
Baeri A, Raineri V, Roccaforte F, La Via F, Zanetti E
Materials Science Forum, 457-460, 873, 2004