검색결과 : 19건
No. | Article |
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1 |
Crystal structure of dephospho-coenzyme A kinase from Haemophilus influenzae Obmolova G, Teplyakov A, Bonander N, Eisenstein E, Howard AJ, Gilliland GL Journal of Structural Biology, 136(2), 119, 2001 |
2 |
High-Rate Reactive Ion Etch and Electron-Cyclotron-Resonance Etching of GaAs via Holes Using Thick Polyimide and Photoresist Masks Shul RJ, Lovejoy ML, Word JC, Howard AJ, Rieger DJ, Kravitz SH Journal of Vacuum Science & Technology B, 15(3), 657, 1997 |
3 |
High-Density Etching of Group-III Nitride Ternary Films Shul RJ, Howard AJ, Pearton SJ, Abernathy CR, Vartuli CB Journal of the Electrochemical Society, 143(10), 3285, 1996 |
4 |
High-Density Plasma-Etching of III-V Nitrides Vartuli CB, Pearton SJ, Abernathy CR, Shul RJ, Howard AJ, Kilcoyne SP, Parmeter JE, Hagerottcrawford M Journal of Vacuum Science & Technology A, 14(3), 1011, 1996 |
5 |
Temperature-Dependent Electron-Cyclotron-Resonance Etching of InP, Gap, and GaAs Shul RJ, Howard AJ, Vartuli CB, Barnes PA, Seng W Journal of Vacuum Science & Technology A, 14(3), 1102, 1996 |
6 |
Treatment of InP Surfaces in Radio-Frequency H-2 and H-2/CH4/Ar Plasmas - In-Situ Compositional Analysis, Etch Rates, and Surface-Roughness Parmeter JE, Shul RJ, Howard AJ, Miller PA Journal of Vacuum Science & Technology B, 14(6), 3563, 1996 |
7 |
Adhesion Studies of GaAs-Based Ohmic Contact and Bond Pad Metallization Seigal PK, Briggs RD, Rieger DJ, Baca AG, Howard AJ Thin Solid Films, 290-291, 503, 1996 |
8 |
A Study of P-Type Ohmic Contacts to InAlAs/InGaAs Heterostructures Briggs RD, Howard AJ, Baca AG, Hafich MJ, Vawter GA Thin Solid Films, 290-291, 508, 1996 |
9 |
Nondestructive Measurement of Porous Silicon Thickness Using X-Ray Reflectivity Guilinger TR, Kelly MJ, Chason EH, Headley TJ, Howard AJ Journal of the Electrochemical Society, 142(5), 1634, 1995 |
10 |
Low-Resistivity Ohmic Contacts to Moderately Doped N-GaAs with Low-Temperature Processing Lovejoy ML, Howard AJ, Zavadil KR, Rieger DJ, Shul RJ, Barnes PA Journal of Vacuum Science & Technology A, 13(3), 758, 1995 |