검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Surface activated bonding of LCP/Cu for electronic packaging Howlader M, Suga T, Takahashi A, Saijo K, Ozawa S, Nanbu K Journal of Materials Science, 40(12), 3177, 2005 |
| No. | Article |
|---|---|
| 1 |
Surface activated bonding of LCP/Cu for electronic packaging Howlader M, Suga T, Takahashi A, Saijo K, Ozawa S, Nanbu K Journal of Materials Science, 40(12), 3177, 2005 |