| 1 |
Characterization of adhesive yield criteria usingmixed-mode loading
Mohapatra PC, Smith LV
Journal of Adhesion Science and Technology, 33(11), 1248, 2019 |
| 2 |
Interaction between diffusion and stresses in composition-gradient electrodes
Li Y, Zhang K, Zheng BL
Solid State Ionics, 283, 103, 2015 |
| 3 |
Characterization and modelling of the 3D elasticplastic behaviour of an adhesively bonded joint under monotonic tension/compression-shear loads: influence of three cure cycles
Maurice J, Cognard JY, Creac'hcadec R, Davies P, Sohier L, Mahdi S
Journal of Adhesion Science and Technology, 27(2), 165, 2013 |
| 4 |
Experimental Analysis of the Influence of Hydrostatic Stress on the Behaviour of an Adhesive Using a Pressure Vessel
Cognard JY, Creac'hcadec R, da Silva LFM, Teixeira FG, Davies P, Peleau M
Journal of Adhesion, 87(7-8), 804, 2011 |
| 5 |
Analysis of the Influence of Hydrostatic Stress on the Behaviour of an Adhesive in a Bonded Assembly
Cognard JY, Creac'hcadec R, Maurice J, Davies P, Peleau M, da Silva LFM
Journal of Adhesion Science and Technology, 24(11-12), 1977, 2010 |
| 6 |
Equal channel angular pressing of metallic powders for nanostructured materials
Yoon SC, Kim HS
Materials Science Forum, 503-504, 221, 2006 |
| 7 |
Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI
Paik JM, Park IM, Joo YC
Thin Solid Films, 504(1-2), 284, 2006 |
| 8 |
Atomistic simulation of the effect of trace elements on grain boundary of aluminum
Namilae S, Shet C, Chandra N, Nieh TG
Materials Science Forum, 357-3, 387, 2001 |
