검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Surface cleaning of copper by thermal and plasma treatment in reducing and inert ambients Hymes S, Kumar KS, Murarka SP, Wang W, Lanford WA Journal of Vacuum Science & Technology B, 16(3), 1107, 1998 |
| 2 |
Passivation of copper by low temperature annealing of Cu/Mg/SiO2 bilayers Wang W, Ding PJ, Hymes S, Murarka SP, Lanford WA Chemical Engineering Communications, 153, 253, 1996 |
| 3 |
Low-Temperature Passivation of Copper by Doping with Al or Mg Lanford WA, Ding PJ, Wang W, Hymes S, Muraka SP Thin Solid Films, 262(1-2), 234, 1995 |