검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Evaluation of adhesion between glass/epoxy composite substrate and copper foil for printed circuit board applications Ikegawa N, Hamada H, Yamanouchi M Composite Interfaces, 9(3), 235, 2002 |
| 2 |
Effect of Compression Process on Void Behavior in Structural Resin Transfer Molding Ikegawa N, Hamada H, Maekawa Z Polymer Engineering and Science, 36(7), 953, 1996 |