검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition Im B, Kim S, Kim SH Thin Solid Films, 636, 251, 2017 |
| 2 |
Surface Morphology Evolution of Cu Thin Films Electrodeposited Directly on Ti Diffusion Barrier in Citric Acid Im B, Kim S Journal of the Electrochemical Society, 162(10), D491, 2015 |
| 3 |
Nucleation and Growth of Cu Electrodeposited Directly on W Diffusion Barrier in Neutral Electrolyte Im B, Kim S Electrochimica Acta, 130, 52, 2014 |
| 4 |
Effect of bath additives on copper electrodeposited directly on diffusion barrier for integrated silicon devices Im B, Kim S Thin Solid Films, 546, 263, 2013 |
| 5 |
실험계획법을 활용한 은 나노 입자의 합성 및 최적화 임재홍, 강경연, 임바드로, 이재성 Korean Chemical Engineering Research, 46(4), 756, 2008 |