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Copper Metallization of Gold Nanostructure Activated Polypyrrole by Electroless Deposition Pandey R, Jian N, Inberg A, Palmer RE, Shacham-Diamand Y Electrochimica Acta, 246, 1210, 2017 |
2 |
Electroless plating of rhenium-based alloys with nickel, cobalt and iron Duhin A, Inberg A, Eliaz N, Gileadi E Electrochimica Acta, 174, 660, 2015 |
3 |
Growth study of nanoscale Re-Ni coatings on functionalized SiO2 using electroless plating Duhin A, Rozenblat-Raz A, Burstein L, Inberg A, Horvitz D, Shacham-Diamand Y, Eliaz N, Gileadi E Applied Surface Science, 313, 159, 2014 |
4 |
Instability Monitoring and Fermi Level Pinning in Phosphate Buffer Saline/Self Assembled Monolayer/Si Electrode System Hemed NM, Inberg A, Shacham-Diamand Y Electrochimica Acta, 130, 728, 2014 |
5 |
On the stability of silicon field effect capacitors with phosphate buffered saline electrolytic gate and self assembled monolayer gate insulator Hemed NM, Inberg A, Shacham-Diamand Y Electrochimica Acta, 111, 720, 2013 |
6 |
Silver nanometer-scale thin films by electroless deposition on insulating surfaces activated by gold nanoparticles Inberg A, Livshits P, Zalevsky Z, Levi M, Shacham-Diamand Y Electrochimica Acta, 113, 792, 2013 |
7 |
Precipitation of gold nanoparticles on insulating surfaces for metallic ultra-thin film electroless deposition assistance Livshits P, Inberg A, Shacham-Diamand Y, Malka D, Fleger Y, Zalevsky Z Applied Surface Science, 258(19), 7503, 2012 |
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Electroless plating of rhenium-nickel alloys Duhin A, Inberg A, Eliaz N, Gileadi E Electrochimica Acta, 56(26), 9637, 2011 |
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The evolution and analysis of electrical percolation threshold in nanometer scale thin films deposited by electroless plating Sabayev V, Croitoru N, Inberg A, Shacham-Diamand Y Materials Chemistry and Physics, 127(1-2), 214, 2011 |
10 |
Formation and characterization of low resistivity sub-100 nm copper films deposited by electroless on SAM Asher T, Inberg A, Glickman E, Fishelson N, Shacham-Diamand Y Electrochimica Acta, 54(25), 6053, 2009 |