화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Chemical Mechanical Planarization of TaN Wafers Using Oxalic and Tartaric Acid Based Slurries
Janjam SVSB, Peethala BC, Roy D, Babu SV
Electrochemical and Solid State Letters, 13(1), II1, 2010
2 Electrochemical investigation of surface reactions for chemically promoted chemical mechanical polishing of TaN in tartaric acid solutions
Janjam SVSB, Peethala BC, Zheng JP, Babu SV, Roy D
Materials Chemistry and Physics, 123(2-3), 521, 2010
3 Oxalic-acid-based slurries with tunable selectivity for copper and tantalum removal in CMP
Janjam SVSB, Surisetty CVVS, Pandija S, Roy D, Babu SV
Electrochemical and Solid State Letters, 11(3), H66, 2008
4 Tartaric Acid as a Complexing Agent for Selective Removal of Tantalum and Copper in CMP
Janjam SVSB, Peddeti S, Roy D, Babu SV
Electrochemical and Solid State Letters, 11(12), H327, 2008