검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects Baklanov MR, Muroyama M, Judelewicz M, Kondoh E, Li H, Waeterloos J, Vanhaelemeersch S, Maex K Journal of Vacuum Science & Technology B, 17(5), 2136, 1999 |