검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu wires for Future LSIs Onuki J, Tashiro S, Khoo K, Ishikawa N, Kimura T, Chonan Y, Akahoshi H Journal of the Electrochemical Society, 157(9), II857, 2010 |
| 2 |
Texture investigation in the trench depth direction of very fine copper wires less than 100 nm wide using electron backscatter diffraction Khoo K, Onuki J Thin Solid Films, 518(12), 3413, 2010 |
| 3 |
Grain coarsening mechanism of Cu thin films by rapid annealing Sasajima Y, Kageyama J, Khoo K, Onuki J Thin Solid Films, 518(23), 6883, 2010 |