| 1 |
Transient mass transfer rate of Cu2+ ion caused by copper electrodeposition with alternating electrolytic current
Kawai S, Ogawa M, Ishibashi K, Kondo Y, Matsuoka T, Homma T, Fukunaka Y, Kida S
Electrochimica Acta, 55(12), 3987, 2010 |
| 2 |
Numerical Calculation of Transient Current Density Distribution along Vertical Plane Electrode in CuSO4-H2SO4 Electrolyte Solution
Kawai S, Fukunaka Y, Kida S
Journal of the Electrochemical Society, 157(3), F40, 2010 |
| 3 |
Numerical Simulation of Ionic Mass-Transfer Rates with Natural Convection in CuSO4-H2SO4 Solution
Kawai S, Fukunaka Y, Kida S
Journal of the Electrochemical Society, 156(9), F109, 2009 |
| 4 |
Numerical Simulation of Ionic Mass-Transfer Rates with Natural Convection in CuSO4-H2SO4 Solution
Kawai S, Fukunaka Y, Kida S
Journal of the Electrochemical Society, 156(9), F99, 2009 |
| 5 |
Numerical simulation of transient natural convection along vertical plane electrodes caused by electrolytic current modulation
Kawai S, Fukunaka Y, Kida S
Journal of the Electrochemical Society, 155(5), F75, 2008 |
| 6 |
Numerical simulation of transient natural convection induced by electrochemical reactions confined between vertical plane Cu electrodes
Kawai S, Nishikawa K, Fukunaka Y, Kida S
Electrochimica Acta, 53(1), 257, 2007 |
| 7 |
Tocopherol-associated protein is a ligand-dependent transcriptional activator
Yamauchi J, Iwamoto T, Kida S, Masushige S, Yamada K, Esashi T
Biochemical and Biophysical Research Communications, 285(2), 295, 2001 |
